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lykos – BIB loader/unloader,
mobile + modular device handling system
for reliable loading/unloading to avoid manual placement/orientation errors

What is a "burn-in-board" (BIB) loading system?

"Burn-in" is a process in which semiconductor components are subjected to temperature stress testing to detect failures caused by design, material, process and/or manufacturing defects at an early stage.

Temperatures of 125 °C to 250 °C (257 °F to 482 °F), applied during the burn-in process, will be maintained for several hours or even days.

 

system key features

  • exclusion of human error during device placement in the BIB
  • device pin1 orientation in BIB
    - damage to device during insertion into BIB
    - handling of up to 1 x 1 mm devices
  • preventing faulty devices due to incorrect orientation during insertion
  • fully automated open top sockets (OTS) loading
  • reliable and easy-to-use device handling system
  • modular machine configurations and options as per specific/individual customer requirements
  • flexible BIB clamping (different sizes)
  • easily moveable, even by one person
  • ergonomic control panel arrangement
  • user-friendly software
  • cost-efficient and easy-to-use conversion kits for different devices
  • conversion time (incl. BIB change) less than 3 minutes

handling key features

  • highly accurate and reliable 4+1-axis portal pick-and-place robot system (±0.05 mm accuracy)
  • high MTBF values, low maintenance efforts
  • free pin1 orientation
  • 17.3" widescreen HMI with multi-touch capability
  • integrated camera system for pick-and-place position teaching
  • RS232/TCP/IP or optional GPIB tester interfaces
  • remote control via Ethernet

lykos conversion kit

lykos BIB loader: loading sequence

lykos BIB loader: unloading sequence