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- lykos BIB loader + unloader
lykos – BIB loader/unloader,
mobile + modular device handling system
for reliable loading/unloading to avoid manual placement/orientation errors
What is a "burn-in-board" (BIB) loading system?
"Burn-in" is a process in which semiconductor components are subjected to temperature stress testing to detect failures caused by design, material, process and/or manufacturing defects at an early stage.
Temperatures of 125 °C to 250 °C (257 °F to 482 °F), applied during the burn-in process, will be maintained for several hours or even days.
system key features
- exclusion of human error during device placement in the BIB
- device pin1 orientation in BIB
- damage to device during insertion into BIB
- handling of up to 1 x 1 mm devices - preventing faulty devices due to incorrect orientation during insertion
- fully automated open top sockets (OTS) loading
- reliable and easy-to-use device handling system
- modular machine configurations and options as per specific/individual customer requirements
- flexible BIB clamping (different sizes)
- easily moveable, even by one person
- ergonomic control panel arrangement
- user-friendly software
- cost-efficient and easy-to-use conversion kits for different devices
- conversion time (incl. BIB change) less than 3 minutes
handling key features
- highly accurate and reliable 4+1-axis portal pick-and-place robot system (±0.05 mm accuracy)
- high MTBF values, low maintenance efforts
- free pin1 orientation
- 17.3" widescreen HMI with multi-touch capability
- integrated camera system for pick-and-place position teaching
- RS232/TCP/IP or optional GPIB tester interfaces
- remote control via Ethernet