lykos – BIB loader/unloader,
mobile + modular device handling system
for reliable loading/unloading to avoid manual placement/orientation errors

"Burn-in" is a crucial procedure employed in the semiconductor industry to subject semiconductor components to rigorous temperature stress testing. The primary objective of this process is to identify and detect any potential failures stemming from design, material, process, or manufacturing defects at an early stage.

During the burn-in process, temperatures ranging from 125 °C to 250 °C (257 °F to 482 °F) are meticulously applied and sustained for several hours, and in some cases, even days. This carefully controlled thermal environment allows for comprehensive evaluation and validation of the components, ensuring their reliability and performance under extreme operating conditions.

• exclusion of human error during device placement in the BIB
• device pin1 orientation in BIB
  - damage to device during insertion into BIB
  - handling of up to 1 x 1 mm devices
• preventing faulty devices due to incorrect orientation during insertion
• fully automated open top sockets (OTS) loading
• reliable and easy-to-use device handling system
• modular machine configurations and options as per specific/individual customer requirements
• flexible BIB clamping (different sizes)
• easily moveable, even by one person
• ergonomic control panel arrangement
• user-friendly software
• cost-efficient and easy-to-use conversion kits for different devices
• conversion time (incl. BIB change) less than 3 minutes

• highly accurate and reliable 4+1-axis portal pick-and-place robot system (±0.05 mm accuracy)
• high MTBF values, low maintenance efforts
• free pin1 orientation
• 17.3" widescreen HMI with multi-touch capability
• integrated camera system for pick-and-place position teaching
• RS232/TCP/IP or optional GPIB tester interfaces
• remote control via Ethernet