EXPRESS configurator for your TH/prober/handler etc.

lykos – BIB loader/unloader,
mobile + modular device handling system
for reliable loading/unloading to avoid manual placement/orientation errors

What is a "burn-in-board" (BIB) loading system?

"Burn-in" is a process in which semiconductor components are subjected to temperature stress testing to detect failures caused by design, material, process and/or manufacturing defects at an early stage.

Temperatures of 125 °C to 250 °C (257 °F to 482 °F), applied during the burn-in process, will be maintained for several hours or even days.

system key features

exclusion of human error during device placement in the BIB
device pin1 orientation in BIB
- damage to device during insertion into BIB
- handling of up to 1 x 1 mm devices
preventing faulty devices due to incorrect orientation during insertion
fully automated open top sockets (OTS) loading
reliable and easy-to-use device handling system
modular machine configurations and options as per specific/individual customer requirements
flexible BIB clamping (different sizes)
easily moveable, even by one person
ergonomic control panel arrangement
user-friendly software
cost-efficient and easy-to-use conversion kits for different devices
conversion time (incl. BIB change) less than 3 minutes

handling key features

highly accurate and reliable 4+1-axis portal pick-and-place robot system (±0.05 mm accuracy)
high MTBF values, low maintenance efforts
free pin1 orientation
17.3" widescreen HMI with multi-touch capability
integrated camera system for pick-and-place position teaching
RS232/TCP/IP or optional GPIB tester interfaces
remote control via Ethernet