From March 2 to March 5, 2025, TestConX took place at the DoubleTree Hotel in Mesa, Arizona, once again bringing together experts from the semiconductor test industry. The conference served as a key platform for exchanging insights on new developments, technological innovations, and best practices in semiconductor testing.
Once again, the esmo semicon was present this year again, showcasing the latest advancements in engineering handlers, manipulators, and interface solutions for various applications. At Booth #9, visitors had the opportunity to engage directly with Bert Bustamante and Homan Amin (esmo USA) together with Andi Eberharter (esmo talos team Germany) to discuss the latest developments in test automation and precision handling.
A particular highlight of the conference was the technical presentation by Andi Eberharter on March 3 at 1:30 PM. Under the title "Challenges & Solutions Handling Small WLCSP Devices", the session focused on the key challenges in testing Wafer-Level Chip-Scale Packages (WLCSP). Special emphasis was placed on force-controlled contacting techniques and optimized handling and test methods, aimed at minimizing mechanical stress and maximizing reliability in test environments. The presentation clearly demonstrated how test methods are evolving to meet the increasing demands of miniaturization and precision.
TestConX 2025 once again provided an excellent opportunity to exchange ideas with industry peers, forge new partnerships, and gain hands-on insights into the future of semiconductor test technology. The esmo group extends its gratitude to all visitors for their valuable discussions and looks forward to driving further innovations in the coming year.