From March 24 to 28, 2025, engineering specialists from the esmo semicon’s Docking & Interfacing team participated in a multi-day workshop in Shanghai to align on processes and future developments. Eight team members from Germany, Singapore, Shanghai, and Tunisia came together to strengthen collaboration and align on the latest developments in the field of Docking & Interfacing.
The main objective of the five-day workshop was to standardize engineering and development processes across all locations, with a strong focus on current trends and upcoming requirements for next-generation solutions. One of the key outcomes was the expansion of the esmo DIB loader portfolio and the definition of a roadmap for the coming years.
In addition, the meeting provided in-depth insights into the engineering and manufacturing capabilities of the Chinese site. The team was impressed by the efficiency as well as the technological standards and capabilities observed on site.
The involvement of the international sales teams from Singapore, China, Europe, and the US added an important market perspective, ensuring that customer requirements are consistently reflected in future product development.
A joint visit to SEMICON China on March 26 offered further opportunities for knowledge exchange and a comparison with other international SEMICON events.
The meeting was a full success – both in terms of technical content and organization. It marks the starting point for a new series of global workshops that will cover additional technological focus areas in the future.