TestConX 2026 once again brought together the global semiconductor test community in Mesa, Arizona. For esmo semicon, the event provided an excellent opportunity to connect with customers, partners and industry experts and to exchange ideas on current challenges and future developments in semiconductor testing.
During the exhibition on March 2–3, numerous visitors stopped by booth #9 to meet the esmo semicon team and discuss solutions for precision device handling and reliable contacting technologies.
As semiconductor devices continue to evolve and package designs become increasingly complex, the requirements for stable and repeatable test processes are constantly growing. This is where esmo semicon’s solutions come into play. By combining force-controlled device handling, highly precise mechanical interfaces and optimized contacting concepts, the company helps customers improve test reliability, process stability and overall efficiency in demanding ATE environments.
Many of the discussions during TestConX focused on practical approaches to handling sensitive semiconductor devices and ensuring reliable electrical contacting under challenging test conditions.
Representing esmo semicon on site were Bert Bustamante and Homan Amin from the esmo semicon USA team, who welcomed visitors at the booth and engaged in numerous valuable discussions with members of the semiconductor test community.
“TestConX continues to be an excellent platform for direct exchange with experts from across the industry,” the team concluded. “The many interesting conversations and new connections once again demonstrated how important collaboration and knowledge sharing are for advancing semiconductor test technologies.”
esmo semicon would like to thank all customers, partners and visitors for the inspiring discussions and looks forward to continuing the conversation beyond TestConX.